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Latest News for March 11th, 2014

Compact thermal modeling for packaged microprocessor design with practical power maps

Our recent work on the compact thermal modeling, which was published on the The Integration, The VLSI Journal, in January 2014 has been one of the most downloaded paper in last 90 days. It has logged 178 downloads during this period. As of May 8, 2014, the paper has been downloaded 263 times and is...