Our recent work on the compact thermal modeling, which was published on the The Integration, The VLSI Journal, in January 2014 has been one of the most downloaded paper in last  90 days.  As of May 8, 2014, the paper has been downloaded 263 times and is still ranked as 19^th of most downloaded papers.  This work was jointly funded by NSF and SRC project.

Z. Liu, S. X.-D. Tan, H. Wang, Y. Hua, and A. Gupta, Compact thermal modeling for packaged microprocessor design with practical power maps, Integration, The VLSI Journal, vol.  47, no. 1, January 2014. (One of the most downloaded papers in 2014 after its publication, 263 downloads in 6 months)see: http://www.journals.elsevier.com/integration-the-vlsi-journal/most-downloaded-articles/  Online access:  http://www.sciencedirect.com/science/article/pii/S0167926013000412