The Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO) continued the funding of the reliability research project at UCR for developing new physics-based compact electromigration (EM) reliability models and assessment techniques for VLSI interconnects. The project is part of the Integrity and Reliability of Integrated circuitS (IRIS) Program Phase III in DARPA. Dr...

Dr. Sheldon Tan has been re-apponted as the Editor-in-Chief (EiC) for Integration, The VLSI Journal for the coming 2018-2020 period. Dr. Tan has been the EiC for Integration, The VLSI Journal since 2016. The impact factor of Integration has increased from 0.703 in 2015 to 1.00 in 2016, which represents 42.4% improvement.