Our recent works on voltage based EM modeling  has been accepted to IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) as follows:

• Z.Sun, E.Demircan, M. D. Shroff, C.Cook, S. X.-D. Tan, "Fast Electromigration Immortality Analysis for Multi-Segment Copper Interconnect Wires" IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), (in press)

Congratulations Zeyu and co-authors.