VSCLAB released the EMspice --  coupled EM-IR drop analysis tool for full-chip EM and IR check and sign-off. This is first tool to perform the full-chip EM-IR drop co-simulation to assess the EM-induced IR drop at specific targeted lifetime. The research work, leaded by Ph.D. student Zeyu Sun, has been published recently in IEEE Transaction on Device and Materials Reliability (TDMR) in 2020.

Z. Sun, S. Yu, H. Zhou, Y. Liu and S. X. -. Tan, "EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation," in IEEE Transactions on Device and Materials Reliability, doi: 10.1109/TDMR.2020.2981628.

The source codes and documents are released in GitHub.