Our recent works on TDDB modeling for interconnect dielectrics has been accepted to IEEE Transactions on Very Large Scale Integreation Systems (TVLSI): S. Peng, H. Zhou, T. Kim, H. Chen, S. X.-D. Tan, "Physics-based Compact TDDB Models for Low-k BEOL Copper Interconnects with Time-Varying Voltage Stressing", IEEE Transactions on Very Large Scale Integreation Systems (TVLSI)...