Our recent works on TDDB modeling for interconnect dielectrics has been accepted to IEEE Transactions on Very Large Scale Integreation Systems
Our recent works on TDDB modeling for interconnect dielectrics has been accepted to IEEE Transactions on Very Large Scale Integreation Systems (TVLSI):
- S. Peng, H. Zhou, T. Kim, H. Chen, S. X.-D. Tan, "Physics-based Compact TDDB Models for Low-k BEOL Copper Interconnects with Time-Varying Voltage Stressing", IEEE Transactions on Very Large Scale Integreation Systems (TVLSI), (in press)
Congratulations Shaoyi and co-authors